Die Bonder Equipment Market – Development Insight and Manufacturers Challenge Competitors

Die Bonder Equipment Consumption Market | Forecast 2018-2023

In this report, Planet Market Reports covers the present scenario with the base year being 2017 and the growth prospects of global Die Bonder Equipment market for 2018-2023.

Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass

Die Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Asia, Europe and US. Among them, Europe output volume accounted for more than 32.09% of the total output of global Die Bonder Equipment in 2016. Besi is the world leading manufacturer in global Die Bonder Equipment market with the market share of 39.21%, in terms of revenue.

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With the increasing in production capacity, expected that the Die Bonder Equipment raw material price will be stable in the short term. However, the improvement of energy, transportation costs, and labor costs, will play a significant role in promoting the cost of Die Bonder Equipment.
The average price of Die Bonder Equipment will fall further. The product average price trend in the past few years was not stable, however, due to the mature manufacturing technology, cost of raw materials, as well as the substitute threat, the average price will decrease in the few future years.
Over the next five years, Planet Market Reports projects that Die Bonder Equipment will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

This report presents a comprehensive overview, market shares, and growth opportunities of Die Bonder Equipment market by product type, application, key manufacturers and key regions.

To calculate the market size, Planet Market Reports considers value and volume generated from the sales of the following segments:

Segmentation by product type:
Fully Automatic
Semi-Automatic
Manual
Segmentation by application:

Integrated Device Manufacturers IDMs
Outsourced Semiconductor Assembly and Test OSAT

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This report also splits the market by region:

Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Besi
ASM Pacific Technology ASMPT
Kulicke & Soffa
Palomar Technologies
Shinkawa
DIAS Automation
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Hybond

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

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